Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8754337 | Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package | — | 2014-06-17 |
| 8455765 | Laminated body, method of manufacturing substrate, substrate, and semiconductor device | Junpei Morimoto | 2013-06-04 |
| 8425790 | Ink-jet ink composition for etching resist | Masaki Sato, Seiju Suzuki, Shuichi Sugita, Shigenori Kobayashi | 2013-04-23 |
| 5302852 | Semiconductor device package having a low profile structure and high strength | Akio Tanda | 1994-04-12 |
| 5284899 | Resin paste for tight sealing | Sueo Morishige, Katsushi Terajima, Toshiro Takeda, Yushi Sakamoto, Takashi Suzuki | 1994-02-08 |
| 5087963 | Glass-sealed semiconductor device | Akio Tanda | 1992-02-11 |