JI

Jun Inasaka

NE Nec: 9 patents #1,539 of 14,502Top 15%
Overall (All Time): #590,401 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
5792293 Method of fabricating a multi-layer wiring substrate 1998-08-11
5585138 Micropin array and production method thereof 1996-12-17
5460677 Filament winding production method for a micropin array 1995-10-24
5373110 Multilayer circuit board with repaired I/O pin and process for repairing I/O pin on multilayer circuit board 1994-12-13
5364276 Micropin array and production thereof 1994-11-15
5271150 Method for fabricating a ceramic multi-layer substrate 1993-12-21
5136471 Laminate wiring board 1992-08-04
4980270 Printer circuit and a process for preparing same 1990-12-25
4827083 Wiring substrate Shin Hasegawa 1989-05-02