Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6676885 | Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies | Kazuo Shimizu | 2004-01-13 |
| 6554598 | Mold assembly for encapsulating semiconductor device | — | 2003-04-29 |
| 6315540 | Molding die for concurrently molding semiconductor chips without voids and wire weep | — | 2001-11-13 |
| 6200121 | Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein | — | 2001-03-13 |
| 5357077 | Apparatus for marking semiconductor devices | — | 1994-10-18 |