Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12420455 | Mold device | Hirotsune Watanabe, So Nakayama, Akinobu Kawai | 2025-09-23 |
| 7582973 | Flip-chip type assembly | — | 2009-09-01 |
| D588593 | Computer | Keisuke Nakayama, Tetsuya Nagata | 2009-03-17 |
| D587259 | Computer | Keisuke Nakayama, Tetsuya Nagata | 2009-02-24 |
| 4578304 | Multilayer wiring substrate | — | 1986-03-25 |