Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12073956 | Conductor, conductive composition and laminate | Hiroya Fukuda, Osamu Numata, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama +2 more | 2024-08-27 |
| 11145432 | Conductor, conductive composition and laminate | Hiroya Fukuda, Osamu Numata, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama +2 more | 2021-10-12 |
| 10870929 | Polypropylene fiber and method for manufacturing polypropylene fiber | Masaki FUJIE, Tomoyoshi Yamashita, Junya Imakita | 2020-12-22 |
| 10643976 | Electronic component, and electronic component manufacturing method | Yurika Otsuka, Tsutomu Takeda, Yuki Matsumoto | 2020-05-05 |
| 10334721 | Electronic component and electronic component manufacturing method | — | 2019-06-25 |
| 10096395 | Conductor, conductive composition and laminate | Hiroya Fukuda, Osamu Numata, Toshio Nagasaka, Shinji Saiki, Hiroaki Iriyama +2 more | 2018-10-09 |
| 7896658 | Apparatus and method for adjusting position of electronic component | — | 2011-03-01 |
| 7755895 | Heat sink, an electronic component package, and a method of manufacturing a heat sink | — | 2010-07-13 |
| 7671477 | Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component | — | 2010-03-02 |
| 6518666 | Circuit board reducing a warp and a method of mounting an integrated circuit chip | — | 2003-02-11 |
| 6285553 | Mounting structure for an LSI | Takayuki Suyama | 2001-09-04 |
| 6271480 | Electronic device | Yukio Yamaguti | 2001-08-07 |
| 6087716 | Semiconductor device package having a connection substrate with turned back leads and method thereof | — | 2000-07-11 |
| 5973930 | Mounting structure for one or more semiconductor devices | Yukio Yamaguti | 1999-10-26 |
| 5436501 | Cooling structure for integrated circuit | — | 1995-07-25 |
| 5285351 | Cooling structure for integrated circuits | — | 1994-02-08 |