Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5526564 | Method of manufacturing a multilayered printed wiring board | Tutomu Ohshima, Ryo Maniwa | 1996-06-18 |
| 5480675 | Method of and apparatus for plating printed circuit board | Tomoo Murakami, Takanori Tsunoda, Ryo Maniwa | 1996-01-02 |
| 5455393 | Multilayered printed wiring board and method of manufacturing the same | Tutomu Ohshima, Ryo Maniwa | 1995-10-03 |
| 5218761 | Process for manufacturing printed wiring boards | Ryo Maniwa | 1993-06-15 |
| 5030373 | Surface-treating agents for copper and copper alloy | Toshiya Kimura, Koichi Wakashima, Shigeki Nakajima, Katsutoshi Itani, Akira Hirai | 1991-07-09 |
| 4668332 | Method of making multi-layer printed wiring boards | Toshiaki Asano, Takashi Atarashi, Sunao Yasui | 1987-05-26 |