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Semiconductor device |
Kouhei Takahashi, Seiji Okabe |
2013-03-12 |
| 8334596 |
Semiconductor device including coupling ball with layers of aluminum and copper alloys |
Kouhei Takahashi, Seiji Okabe |
2012-12-18 |
| 8299620 |
Semiconductor device with welded leads and method of manufacturing the same |
Kouhei Takahashi |
2012-10-30 |
| 7944052 |
Semiconductor device |
Kouhei Takahashi, Seiji Okabe |
2011-05-17 |
| 7820489 |
Method of manufacturing semiconductor apparatus |
Kouhei Takahashi |
2010-10-26 |
| 7791198 |
Semiconductor device including a coupling region which includes layers of aluminum and copper alloys |
Kouhei Takahashi, Seiji Okabe |
2010-09-07 |
| 7772031 |
Semiconductor apparatus manufacturing method |
Kouhei Takahashi |
2010-08-10 |
| 7723837 |
Semiconductor device |
Ikuo Komatsu |
2010-05-25 |
| 7550829 |
Electronic package and semiconductor device using the same |
— |
2009-06-23 |
| 7449370 |
Production process for manufacturing such semiconductor package |
— |
2008-11-11 |
| 7274090 |
Electronic package and semiconductor device using the same |
— |
2007-09-25 |
| 7224045 |
Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
Yukinori Tabira |
2007-05-29 |
| 7189599 |
Lead frame, semiconductor device using the same and method of producing the semiconductor device |
— |
2007-03-13 |
| 7138673 |
Semiconductor package having encapsulated chip attached to a mounting plate |
— |
2006-11-21 |