Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6779702 | Wire bonding apparatus with spurious vibration suppressing structure | Naoto Kimura | 2004-08-24 |
| 6575348 | Wire bonding apparatus with spurious vibration suppressing structure | Naoto Kimura | 2003-06-10 |
| 5535789 | Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire | Yutaka Takahashi, Junichi Uehara | 1996-07-16 |