Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10243492 | Semiconductor device and electrically-powered equipment | Atsuko Maekawa, Yuuki Akashi, Tetsuhiko Inoue | 2019-03-26 |
| 10075111 | Semiconductor device and electrically-powered equipment | Atsuko Maekawa, Yuuki Akashi, Tetsuhiko Inoue | 2018-09-11 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base | — | 2007-07-10 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone | — | 2006-12-05 |
| 6882040 | Semiconductor device | — | 2005-04-19 |
| 6879033 | Semiconductor device | — | 2005-04-12 |
| 6853066 | Semiconductor device | — | 2005-02-08 |
| 6072122 | Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates | — | 2000-06-06 |
| 5795799 | Method for manufacturing electronic apparatus sealed by concave molded resin enveloper | — | 1998-08-18 |