Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6849930 | Semiconductor device with uneven metal plate to improve adhesion to molding compound | Yoshihiro Nakajima | 2005-02-01 |
| 6747360 | Conductive hardening resin for a semiconductor device and semiconductor device using the same | Kazuto Oonami | 2004-06-08 |
| 6733695 | Electrically conductive paste and semiconductor device prepared by using the paste | Kazuto Onami, Toshiro Takeda, Yoshihiro Nakajima | 2004-05-11 |
| 6720647 | Semiconductor device and method of manufacturing the same | — | 2004-04-13 |
| 6613829 | Conductive hardening resin for a semiconductor device and semiconductor device using the same | Kazuto Oonami | 2003-09-02 |