Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240505 | Method of etching backside Si substrate of SOI substrate to expose SiO2 layer using fluonitric acid | Tadahiro Ohmi, Kazuhiro Yoshikawa, Tatsuro Yoshida, Teppei Uchimura, Kazuki Soeda +1 more | 2016-01-19 |
| 8728338 | Ultra high-speed wet etching apparatus | Tadahiro Ohmi, Kazuhiro Yoshikawa, Tetsuro Yoshida, Teppei Uchimura, Kazuki Soeda | 2014-05-20 |