Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9304167 | Apparatus of three-dimensional integrated-circuit chip using fault-tolerant test through-silicon-via | Fu-Wei Chen | 2016-04-05 |
| 8174126 | Stacked multi-chip | Hsien-Te Chen | 2012-05-08 |
| 7146885 | Sectionless length adjustment mechanism for tool shank | Yi-Chun Tseng | 2006-12-12 |