Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030139 | Sn—Cu mixed alloy solder paste, method of making the same and soldering method | Wallace Chuang, Eckart Schellkes, Chia-Yu Liu | 2024-07-09 |
| 9233521 | Tin whisker mitigation material using thin film metallic glass underlayer | Jinn Chu, I Made Wahyu Diyatmika, Wen-Zhi Chang | 2016-01-12 |
| 8956473 | Method for manufacturing Ni/In/Sn/Cu multilayer structure | Pin-Ju Huang | 2015-02-17 |
| 8246765 | Method for inhibiting growth of tin whiskers | Meng-Yu Tsou, Chien-Chung Jao | 2012-08-21 |