Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056796 | Directly flat-attached switching component for active frequency selective surface and fabricating method thereof | Jian Ruan, Shyh-Jer Huang | 2021-07-06 |
| 10923621 | Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate | Chun-Te Wu, Cheng-Hung Shih, Hong-Ting Huang | 2021-02-16 |
| 10711342 | Method of producing secondary lens with hollow nano structures for uniform illuminance | Jian Ruan, Shyh-Jer Huang | 2020-07-14 |
| 10384941 | Method for producing spherical silicon nitride powder | Chun-Te Wu, Kuan-Ting Lai, Cheng-Hung Shih | 2019-08-20 |
| 10362684 | Method for improving adhesion between ceramic carrier and thick film circuit | Chia-Ting Lin, Jlin-Fuh Yau, Chung-Yen Lu | 2019-07-23 |
| 10144645 | Method for preparing spherical aluminum oxynitride powder | Kuan-Ting Lai, Chun-Te Wu, Cheng-Hung Shih, Lea-Hwung Leu | 2018-12-04 |
| 10060036 | Plated-layer structure for improving interface stress between aluminium nitride substrate and copper-plated layer | Chun-Te Wu | 2018-08-28 |
| 9978590 | Method of manufacturing epitaxiable heat-dissipating substrate | Jian Ruan, Shyh-Jer Huang, Hsin-Chieh Yu | 2018-05-22 |
| 9196508 | Method for producing three-dimensional integrated circuit structure | Chia-Yi Hsiang, Hung-Tai Ku | 2015-11-24 |