Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10329681 | Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire | Liang Jiang, Ren Fang, Chien-Liang Chang, Yu-Ping Wang, Ming-Ta Hsieh | 2019-06-25 |
| 9472851 | Nonplanar antenna embedded package structure and method of manufacturing the same | Chia-Hua Chang, Chih-Hsing Wang, Chun-Yu Lee | 2016-10-18 |