Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9672426 | Intelligent monitoring system | Chung-I Chiang | 2017-06-06 |
| 9406860 | Wafer level package structure for temperature sensing elements | Chung-I Chiang | 2016-08-02 |
| 9299862 | Device packaging method and device package structure | Chung-I Chiang | 2016-03-29 |
| 6710852 | Method and apparatus of wafer exposure with correction feedback | Cheng-Ming Chen, Wen-Hao Chang | 2004-03-23 |