Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659886 | Method of fabricating semiconductor device having voids between top metal layers of metal interconnects | Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu, Ying-Cheng Chuang | 2017-05-23 |
| 9418949 | Semiconductor device having voids between top metal layers of metal interconnects | Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu, Ying-Cheng Chuang | 2016-08-16 |
| 7413993 | Process for removing a residue from a metal structure on a semiconductor substrate | Ronald Gottzein, Jens Bachmann, Dirk Efferenn, Uwe Kahler, Wen-Bin Lin +1 more | 2008-08-19 |
| 7157381 | Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits | Dirk Efferenn, Jens Hahn, Uwe Kahler, Jens Bachmann, Wen-Bin Lin +1 more | 2007-01-02 |