Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008478 | Fabricating method for wafer-level packaging | — | 2018-06-26 |
| 9515010 | Semiconductor packaging structure and forming method therefor | Xin Xia, Guohua Gao | 2016-12-06 |
| 8890320 | Via arrangement and semiconductor device with the via arrangement | Jerry Liu, Wendy Wei | 2014-11-18 |