YH

Yohei Hosono

NA Namics: 1 patents #52 of 113Top 50%
Overall (All Time): #2,746,512 of 4,157,543Top 70%
1
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11104832 Liquid epoxy resin sealing material and semiconductor device Nozomu Sasage 2021-08-31