Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485848 | NCF for pressure mounting, cured product thereof, and semiconductor device including same | Kenichi Tosaka, Yoshihide Fukuhara, Hiromi Saito, Masaaki Hoshiyama | 2022-11-01 |
| 11315846 | Semiconductor device | Hiroki MYODO, Masaaki Hoshiyama | 2022-04-26 |
| 10738187 | Resin composition and semiconductor device | Hiroki MYODO | 2020-08-11 |
| 10388583 | Thermosetting resin composition and method of producing same | Masaaki Hoshiyama, Toshiaki Enomoto | 2019-08-20 |
| 10023775 | Film adhesive and semiconductor device including the same | Satomi Kawamoto, Yoshihide Fukuhara, Hiromi Saito, Atsushi Saito | 2018-07-17 |
| 9417228 | Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method | Toshiaki Enomoto, Arata Hayashigaki, Masaaki Hoshiyama, Toshiyuki Sato | 2016-08-16 |