Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362310 | Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component | Daisuke Mori, Masahiro ASAHARA, Eiichi Nomura | 2025-07-15 |
| 11718770 | Curable resin composition and curable sheet | Takayuki Hashimoto, Eiichi Nomura, Daisuke Mori, Yosuke Oi, Yukio Yada +2 more | 2023-08-08 |
| 11608435 | Epoxy resin composition, electronic component mounting structure, and method for producing the same | Yasuhito Fujii, Yosuke Oi | 2023-03-21 |
| 9963587 | Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device | Yukari Kouno | 2018-05-08 |