Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136585 | Radio frequency identification tag | Po-Ching Chen | 2015-09-15 |
| 9105814 | Light emitting diode and method of the same | — | 2015-08-11 |
| 8344500 | Integrated circuit package module and method of the same | Po-Ching Chen | 2013-01-01 |
| 8344734 | Test module for radio frequency identification chips and method of the same | — | 2013-01-01 |
| 7999191 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object | — | 2011-08-16 |
| 7943426 | Package structure for integrated circuit device and method of the same | — | 2011-05-17 |
| 7886421 | Method for manufacturing integrated circuit device having antenna conductors | P.C. Chen, Yu Ma | 2011-02-15 |
| 7772698 | Package structure for integrated circuit device | Yu Ma, P.C. Chen | 2010-08-10 |
| 7698805 | Method for manufacturing integrated circuit device having antenna conductors | P.C. Chen, Yu Ma | 2010-04-20 |
| 7459345 | Packaging method for an electronic element | — | 2008-12-02 |
| 7413670 | Method for forming wiring on a substrate | — | 2008-08-19 |
| 7312142 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object | — | 2007-12-25 |
| 7273768 | Wafer-level package and IC module assembly method for the wafer-level package | — | 2007-09-25 |
| 6940183 | Compound filled in lead IC packaging product | — | 2005-09-06 |
| 6602762 | System and method of laser sintering dies and dies sintered by laser sintering | Dang-Cheng Yiu | 2003-08-05 |