Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12003015 | Antenna module, manufacturing method thereof, and collective board | Yuri YAMAKAWA, Yoshiki Yamada | 2024-06-04 |
| 11963294 | Multilayer resin substrate, and method of manufacturing multilayer resin substrate | Tomohiro FURUMURA, Hirotaka Fujii | 2024-04-16 |
| 11909088 | Transmission line member including first and third transmission line portions connected by a second coplanar waveguide portion of reduced thickness and greater width | — | 2024-02-20 |
| 11553588 | Transmission line board, and joint structure of transmission line board | Tomohiro Nagai, Kazuhiro Yamaji | 2023-01-10 |
| 11417949 | Antenna module and communication device having same mounted therein | Kaoru Sudo, Kengo Onaka, Hirotsugu MORI | 2022-08-16 |
| 11291125 | Multilayer substrate, electronic device, and method of manufacturing multilayer substrate | Tomohiro Nagai, Kazuhiro Yamaji | 2022-03-29 |
| 11266016 | Resin multilayer substrate and electronic apparatus | Yusuke Kamitsubo, Ryosuke TAKADA, Tsuyoshi Katsube, Yasuhiro Kuratani, Tomohiro FURUMURA | 2022-03-01 |
| 11246214 | Resin multilayer board | Tomohiro Nagai | 2022-02-08 |
| 11152695 | Antenna module | Keisei TAKAYAMA, Kaoru Sudo | 2021-10-19 |
| 10455706 | Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate | Kuniaki YOSUI, Yuki Ito | 2019-10-22 |
| 10338031 | Component-embedded substrate and substrate flaw detecting method | Hirofumi Shinagawa, Toshiro Adachi | 2019-07-02 |
| 10278289 | Resin circuit board and resin circuit board having component mounted thereon | Kuniaki YOSUI, Masaki KAWATA | 2019-04-30 |
| 10231342 | Component built-in substrate | Hirofumi Shinagawa, Yuki Wakabayashi | 2019-03-12 |
| 10219367 | Multilayer resin substrate, and method of manufacturing multilayer resin substrate | Hirofumi Shinagawa | 2019-02-26 |
| 10166747 | Resin multilayer substrate and method of manufacturing the same | Keisuke Ikeno, Hirohumi Shinagawa, Kuniaki YOSUI, Yuki Ito | 2019-01-01 |
| 10158157 | High-frequency signal line and manufacturing method thereof | Nobuo IKEMOTO, Yuki Wakabayashi | 2018-12-18 |
| 10028388 | Component-embedded substrate | Daisuke Tsuruga | 2018-07-17 |
| 9986139 | Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same | Hirofumi Shinagawa, Jerry HSIEH, Satoshi Sasaki, Jun Sasaki, Nobuo IKEMOTO +1 more | 2018-05-29 |
| 9974185 | Component-embedded substrate | Hirofumi Shinagawa, Yuki Wakabayashi, Kuniaki YOSUI, Yuki Ito, Toshiro Adachi +2 more | 2018-05-15 |
| 9961780 | Method for manufacturing resin multilayer board | Hirofumi Shinagawa, Masaki KAWATA, Yuki Ito | 2018-05-01 |
| 9922918 | Substrate for stacked module, stacked module, and method for manufacturing stacked module | Hirofumi Shinagawa, Yuki Wakabayashi | 2018-03-20 |
| 9882256 | High-frequency signal transmission line and electronic apparatus | Noboru Kato, Jun Sasaki, Junichi Kurita, Satoshi Sasaki | 2018-01-30 |
| 9854663 | Radio frequency module | — | 2017-12-26 |
| 9854677 | Module component | Hirofumi Shinagawa, Masaki KAWATA, Yuki Ito | 2017-12-26 |
| 9848489 | Multilayer resin substrate, and method of manufacturing multilayer resin substrate | Hirofumi Shinagawa | 2017-12-19 |