Issued Patents All Time
Showing 26–50 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9456494 | Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate | Yoshihito Otsubo | 2016-09-27 |
| 9344589 | Image processing apparatus, image processing method, and recording medium | — | 2016-05-17 |
| 9253881 | Multilayer flexible substrate | Yoshihito Otsubo | 2016-02-02 |
| 9226400 | Multilayer ceramic electronic device and method for manufacturing the same | Masato Nomiya, Mitsuyoshi Nishide | 2015-12-29 |
| 9138465 | Pharmaceutical composition for treating lysosomal storage disease | Keiichi Ozono, Takanobu Otomo | 2015-09-22 |
| 8720050 | Method for manufacturing multilayer substrate with built-in chip-type electronic component | Osamu Chikagawa | 2014-05-13 |
| 8604349 | Multilayer substrate and manufacturing method thereof | — | 2013-12-10 |
| 8419354 | Steam turbine | Naoki Shibukawa, Hiroshi Ikeda, Ryozo Udagawa | 2013-04-16 |
| 8371026 | Method for manufacturing multilayer ceramic electronic device | Masato Nomiya, Mitsuyoshi Nishide | 2013-02-12 |
| 8308887 | Via hole forming method using electrophotographic printing method | Kazuhiro Isebo, Kenji Kawakami, Nobuaki Ogawa | 2012-11-13 |
| 8299968 | Packaging material with electromagnetic coupling module | Makoto Osamura, Noboru Kato | 2012-10-30 |
| 8248668 | Image processing device, image processing method, and image forming apparatus | — | 2012-08-21 |
| 8031124 | Container with electromagnetic coupling module | Noboru Kato | 2011-10-04 |
| 8012287 | Via hole forming method using electrophotographic printing method | Kazuhiro Isebo, Kenji Kawakami, Nobuaki Ogawa | 2011-09-06 |
| 7851708 | Composite substrate and method for manufacturing composite substrate | Mitsuyoshi Nishide | 2010-12-14 |
| 7750247 | Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same | Osamu Chikagawa | 2010-07-06 |
| 7736830 | Method for forming circuit pattern | Akihiko Kamada, Issei Yamamoto | 2010-06-15 |
| 7701053 | Electronic component and method for producing the same | Yoshihiko Nishizawa, Isao Kato | 2010-04-20 |
| 7656677 | Multilayer electronic component and structure for mounting multilayer electronic component | Nobuaki Ogawa | 2010-02-02 |
| 7649252 | Ceramic multilayer substrate | Jun Harada, Satoshi Ishino, Yoshihiko Nishizawa | 2010-01-19 |
| 7595997 | Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component | Masato Nomiya, Mitsuyoshi Nishide | 2009-09-29 |
| 7569925 | Module with built-in component | Yoshihiko Nishizawa | 2009-08-04 |
| 7450395 | Circuit module and circuit device including circuit module | — | 2008-11-11 |
| 7446262 | Laminated electronic component and method for producing the same | Nobuaki Ogawa, Yoshihiko Nishizawa | 2008-11-04 |
| 7162794 | Manufacturing method for multilayer ceramic elements | Kazuhiro Iida | 2007-01-16 |