Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154847 | Semiconductor device including semiconductor chip having elongated bumps | Kazuhiro Ueda | 2024-11-26 |
| 11855677 | High-frequency signal transmission-reception circuit | Syunji Yoshimi | 2023-12-26 |
| 11601153 | High-frequency signal transmission-reception circuit | Syunji Yoshimi | 2023-03-07 |
| 11289415 | Semiconductor device including semiconductor chip having elongated bumps | Kazuhiro Ueda | 2022-03-29 |
| 10892720 | Control circuit for power amplifier | Takeyuki Okabe, Fuminori Morisawa, Yuri HONDA | 2021-01-12 |
| 10848105 | Power amplification module | Satoshi Sakurai | 2020-11-24 |
| 10469033 | Power amplification module | Satoshi Sakurai | 2019-11-05 |
| 10135398 | Power amplification module | Satoshi Sakurai | 2018-11-20 |
| 5672365 | Die assembly for molding a lead screw | Kiyoshi Ishii | 1997-09-30 |
| 5533247 | Method for fabricating a lead screw made of synthetic resin material and having a core tube therein | Kiyoshi Ishii | 1996-07-09 |