Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6855222 | Method for manufacturing laminated multilayer electronic components | Masaharu Konoue | 2005-02-15 |
| 6733696 | Conductive paste | — | 2004-05-11 |
| 5508562 | Outer electrode structure for a chip type electronic part appropriate for reflow soldering | Shigeyuki Horie | 1996-04-16 |
| 4870225 | Mounting arrangement of chip type component onto printed circuit board | Yoshitsugu Hori, Keiichi Shimamaki, Tadashi Sato | 1989-09-26 |
| 4736841 | Electronic component series | Fumihiko Kaneko, Takashi Kawamura, Keiichi Shimamaki | 1988-04-12 |
| 4633370 | Chip-like electronic component series | Mitsuro Hamuro, Keiichi Shimamaki | 1986-12-30 |