Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9844138 | Multilayer wiring board | — | 2017-12-12 |
| 9686858 | Composite module | — | 2017-06-20 |
| 9538644 | Multilayer wiring substrate and module including same | — | 2017-01-03 |
| 9461619 | High-frequency module | Yuji Nurikabe | 2016-10-04 |
| 9370092 | Multilayer wiring board | — | 2016-06-14 |
| 9319092 | High-frequency module | — | 2016-04-19 |
| 9220164 | High frequency module | — | 2015-12-22 |
| 9119318 | Multilayer substrate module | Takeshi Kogure | 2015-08-25 |
| 9118298 | High frequency module | — | 2015-08-25 |
| 8963652 | Duplexer and circuit module including the same | — | 2015-02-24 |
| 8861498 | High-frequency module | — | 2014-10-14 |
| 7151321 | Laminated electronic component | Keiji Ogawa, Mitsuhide Kato | 2006-12-19 |