Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10959327 | Multilayer wiring substrate | Shinichi Araki, Hideyuki Taguchi, Ryosuke TAKADA | 2021-03-23 |
| 10154597 | Component mount board | Makoto Takeoka, Masaki KAWATA, Tomohiko Naruoka | 2018-12-11 |