Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11910540 | Circuit board with solder mask on internal copper pad | Hong-Tu Zhang | 2024-02-20 |
| 11317521 | Resin flow restriction process and structure | Hong-Tu Zhang, Xin Zeng | 2022-04-26 |
| 11122674 | PCB with coin and dielectric layer | Xin Zeng, Jian Ying Xue, Hong-Tu Zhang | 2021-09-14 |
| 10772220 | Dummy core restrict resin process and structure | J L Zhou | 2020-09-08 |
| 10321560 | Dummy core plus plating resist restrict resin process and structure | Mark Zhang, Jiawen Chen | 2019-06-11 |
| 10292279 | Disconnect cavity by plating resist process and structure | Jiawen Chen | 2019-05-14 |
| 9999134 | Self-decap cavity fabrication process and structure | Mark Zhang, Kwan Pen | 2018-06-12 |
| 9992880 | Rigid-bend printed circuit board fabrication | Mark Zhang, Jiawen Chen | 2018-06-05 |
| 9867290 | Selective segment via plating process and structure | Kwan Pen | 2018-01-09 |
| 9763327 | Selective segment via plating process and structure | Kwan Pen | 2017-09-12 |
| 9661738 | Embedded coins for HDI or SEQ laminations | Henrik Jacobsson | 2017-05-23 |