Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6291577 | Method for scavenging moisture in polyisocyanates and formulations thereof | Hui S. Yang | 2001-09-18 |
| 5554785 | Organotin catalyzed transesterification products | Louise E. Trapasso, Stanley J. Padegimas, Peter F. Epstein, Purnendu Mukhopadhyay, Philip L. Meisel | 1996-09-10 |
| 5498751 | Organotin catalyzed transesterification | Louis E. Trapasso, Stanley J. Padegimas, Peter F. Epstein, Purnendu Mukhopadhyay, Philip L. Meisel | 1996-03-12 |
| 5148765 | Printed-wireboard photoimaging | John Cioffi, Mark L. Lavach | 1992-09-22 |
| 5100946 | Stabilized halogen containing polymer compositions | William L. Smith, Daniel B. Dess, Sriram Seshadri | 1992-03-31 |
| 5006436 | UV curable compositions for making tentable solder mask coating | Kenneth Tseng | 1991-04-09 |
| 4874799 | Aqueous akaline developable, UV curable urethane acrylate compounds and compositions useful for forming liquid 100 percent solids, solvent-free solder mask coatings | Kenneth Tseng | 1989-10-17 |
| 4849321 | UV curable compositions for making improved solder mask coatings | Kenneth Tseng | 1989-07-18 |
| 4761363 | UV curable compositions for making improved solder mask coatings | Kenneth Tseng | 1988-08-02 |
| 4753860 | UV curable compositions for making improved solder mask coatings | Kenneth Tseng | 1988-06-28 |
| 4717740 | Aqueous alkaline developable, UV curable urethane acrylate compounds and compositions useful for forming solder mask coatings | Kenneth Tseng | 1988-01-05 |
| 4713298 | Printed circuit boards having improved adhesion between solder mask and metal | Richard J. Radigan, David S. Rosen | 1987-12-15 |
| 4615950 | Printed circuit boards having improved adhesion between solder mask and metal | Richard J. Radigan, David S. Rosen | 1986-10-07 |
| 4614704 | Stable UV curable compositions comprising triphenyl phosphite for forming solder mask coatings of high cure depth | Mark L. Lavach | 1986-09-30 |