Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6060666 | Electrolytic layer applied to metallic foil to promote adhesion to a polymeric substrate | — | 2000-05-09 |
| 5919379 | Copper-foil having a protective layer and copper-clad laminates using same | — | 1999-07-06 |
| 4781991 | Production of dielectric boards | Gursharan S. Sarang | 1988-11-01 |
| 4715116 | Production of dielectric boards | Gursharan S. Sarang | 1987-12-29 |