Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050235 | Heat dissipatable die unit and probe seat using the same | Chin-Yi Lin, Che-Wei Lin, KO-CHUN WU | 2024-07-30 |
| D1031738 | Die plate assembly for probe head | Chin-Yi Lin, Che-Wei Lin, Hsin-Cheng Hung | 2024-06-18 |
| 11733267 | Probe head and probe card | Che-Wei Lin, Ting-Ju Wu, Chin-Yi Lin | 2023-08-22 |
| 11619656 | Probe head and die set having horizontally fine adjustable die and probe head adjusting method | Chin-Yi Lin, Che-Wei Lin, Hsin-Cheng Hung | 2023-04-04 |