Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6813154 | Reversible heat sink packaging assembly for an integrated circuit | Jose Diaz, Harold M. Cook | 2004-11-02 |
| 6784366 | Thermal dissipation package for an electrical surface mount component | Harold M. Cook, Jose Diaz | 2004-08-31 |
| 6208526 | Mounting multiple substrate frame and leadless surface mountable assembly using same | Curtis M. Griffin, Jeffrey A. Rollman | 2001-03-27 |