Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117685 | Reconfiguring through silicon vias in stacked multi-die packages | — | 2015-08-25 |
| 9009423 | Serially connected memory having subdivided data interface | — | 2015-04-14 |
| 8812768 | System having one or more memory devices | Steven PRZYBYLSKI, HakJune Oh, Hong Beom Pyeon | 2014-08-19 |
| 8767430 | Configurable module and memory subsystem | Peter B. Gillingham | 2014-07-01 |
| 8675425 | Single-strobe operation of memory devices | Jin-Ki Kim | 2014-03-18 |
| 8637984 | Multi-chip package with pillar connection | — | 2014-01-28 |
| 8604593 | Reconfiguring through silicon vias in stacked multi-die packages | — | 2013-12-10 |
| 8587111 | Multi-chip package with thermal frame and method of assembling | — | 2013-11-19 |
| 8503211 | Configurable module and memory subsystem | Peter B. Gillingham | 2013-08-06 |
| 8443233 | Methods and systems for failure isolation and data recovery in a configuration of series-connected semiconductor devices | — | 2013-05-14 |
| 8406070 | Single-strobe operation of memory devices | Jin-Ki Kim | 2013-03-26 |
| 7889578 | Single-strobe operation of memory devices | Jin-Ki Kim | 2011-02-15 |
| 7836340 | Methods and systems for failure isolation and data recovery in a configuration of series-connected semiconductor devices | — | 2010-11-16 |