Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825607 | Package substrate manufacturing method | Meng MEI, Gang Shi, Peichun Wang | 2023-11-21 |
| 11489993 | Camera assembly and electronic device | Wei Tang, Na Wang | 2022-11-01 |
| 11393732 | Method for testing electrical performance of packaged chip | Meng MEI, Gang Shi, Peichun Wang | 2022-07-19 |