Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11691313 | Processing apparatus including a water collection pan | Toshiyasu Rikiishi | 2023-07-04 |
| 10093095 | Method for controlling inkjet printing apparatus | Hideo Izawa, Seiji Komatsuda | 2018-10-09 |
| 9925772 | Method for controlling inkjet printing apparatus | Hideo Izawa, Seiji Komatsuda | 2018-03-27 |
| 9707755 | Method for controlling inkjet printing apparatus | Hideo Izawa, Seiji Komatsuda | 2017-07-18 |
| 9290013 | Inkjet recording apparatus | Hideo Izawa, Takao Namiki, Akira Ishikawa | 2016-03-22 |
| 9090093 | Ink jet recording apparatus | Hideo Izawa, Takao Namiki, Akira Ishikawa | 2015-07-28 |
| 8189026 | Method and apparatus for correcting print images in an electrophotographic printer | Hideo Izawa, Osamu Ebuchi | 2012-05-29 |
| 7792442 | Electronic photograph printer | Hideo Izawa, Osamu Ebuchi | 2010-09-07 |
| 6910943 | Planarization apparatus and method | Toshihiko Ishikawa | 2005-06-28 |
| 6910403 | Method for cutting semiconductor wafer protecting sheet | Toshihiko Ishikawa | 2005-06-28 |
| 6782817 | Printing machine | Hideo Izawa, Yuichi Yamazaki | 2004-08-31 |
| 6583032 | Method for manufacturing semiconductor chips | Toshihiko Ishikawa | 2003-06-24 |
| 6517420 | Wafer surface machining apparatus | Toshihiko Ishikawa | 2003-02-11 |
| 6431949 | Planarization apparatus | Toshihiko Ishikawa | 2002-08-13 |
| 6431964 | Planarization apparatus and method | Toshihiko Ishikawa | 2002-08-13 |
| 6309046 | Multiple-head ink jet printer | Hideo Izawa | 2001-10-30 |
| 6280308 | Wafer suction pad | Toshihiko Ishikawa | 2001-08-28 |
| 6257966 | Wafer surface machining apparatus | Toshihiko Ishikawa | 2001-07-10 |