Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847371 | Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same | Takayuki Otsuka, Ryuichi Wada, Makoto KITAZUME, Toshiki KOMIYAMA | 2014-09-30 |