Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5149465 | Conductive resin composition | Toru Ueki, Kenji Sakata, Masaji Yoshimura, Kazuharu Kanezaki | 1992-09-22 |
| 5075035 | Molding material for electroconductive IC parts | Toru Ueki, Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Susumu Kishi | 1991-12-24 |