Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9396834 | Metal foil provided with filler-containing resin layer and method for manufacturing metal foil provided with filler-containing resin layer | — | 2016-07-19 |
| 6986937 | Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer | Kazuhiro Yamazaki | 2006-01-17 |
| 6903916 | Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection | Kazuhiro Yamazaki | 2005-06-07 |
| 6652993 | Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer | Takuya Yamamoto | 2003-11-25 |