Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8394509 | Surface-treated copper foil | Hiroshi Watanabe, Kazufumi Izumida | 2013-03-12 |
| 8187722 | Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet | Hiroshi Watanabe, Kazufumi Izumida | 2012-05-29 |
| 7883783 | Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board | — | 2011-02-08 |
| 7851053 | Copper clad laminate | Takuya Yamamoto, Masahiko Nakano | 2010-12-14 |
| 7749610 | Copper foil and method of manufacturing the same | Kenichiro Iwakiri | 2010-07-06 |
| 7691487 | Electrodeposited copper foil with carrier foil | — | 2010-04-06 |
| 7358189 | Copper clad laminate | Takuya Yamamoto, Masahiko Nakano | 2008-04-15 |