Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7255919 | Mold release layer transferring film and laminate film | Katsuhiko Hayashi | 2007-08-14 |
| 7198989 | Method of producing a COF flexible printed wiring board | Katsuhiko Hayashi | 2007-04-03 |
| 7173322 | COF flexible printed wiring board and method of producing the wiring board | Katsuhiko Hayashi | 2007-02-06 |
| 6900989 | Flexible printed wiring board with semiconductor chip and releasing layer | — | 2005-05-31 |