Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329848 | Ethylenic copolymer, composition containing the copolymer and use thereof | Takayuki Kajihara, Hiroshi Uehara, Shigenobu Ikenaga, Kiminori Noda | 2012-12-11 |
| 8148431 | Osteogenesis promoter containing β-cryptoxanthin as the active ingredient | — | 2012-04-03 |
| 8097672 | Crosslinked material of propylene resin composition, a process for producing the crosslinked material and crosslinked molded article formed from the crosslinked material | Hiroshi Uehara, Kiminori Noda | 2012-01-17 |
| 7957595 | Database management program, database management apparatus and database management method | Terutoshi Taguchi | 2011-06-07 |
| 7851540 | Resin composition and molded body made from same | Hiroshi Uehara | 2010-12-14 |
| 7355093 | Model animal with overexpression of regucalcin | — | 2008-04-08 |
| 7259211 | Ethylene type ternary copolymer and propylene type resin composition | Kouichi Kizu, Keiji Okada | 2007-08-21 |
| 7196130 | Thermoplastic resin composition, polymer composition, and molded product comprising the composition | Hiroshi Uehara, Tomohiko Kimura, Satoru Moriya, Hideshi Kawachi | 2007-03-27 |
| 6933346 | Sealant for polypropylene and easily openable hermetically sealed package including the same | Naoto Yasaka | 2005-08-23 |
| 6841583 | Composition and uses thereof | Takanori Sueda, Atsushi Komoriya, Kouichi Kizu | 2005-01-11 |
| 6806252 | Bone-strengthening agents, food compositions for strengthening bone and feed compositions for strengthening | — | 2004-10-19 |
| 6803414 | Damping resin composition and damping resin article for structure using the resin composition | Takeshi Honjo, Harushige Yamamura, Tai Uruji, Yusuke Koizumi, Hiroshi Hayashi | 2004-10-12 |
| 6673464 | Soft resin composition for injection molding and uses thereof | Tomoya Matayoshi, Naoto Yasaka | 2004-01-06 |
| 6418030 | Multi-chip module | Mitsutoshi Sawano, Kazutoshi Hohki | 2002-07-09 |
| 6315856 | Method of mounting electronic component | Satoru Asagiri | 2001-11-13 |
| 6310164 | Unsaturated copolymers, processes for preparing the same, and compositions containing the same | Kenichi Morizono, Keiji Okada | 2001-10-30 |
| 6245582 | Process for manufacturing semiconductor device and semiconductor component | Eiichi Harada | 2001-06-12 |
| 6244106 | Electrical power cable underground laying depth measuring method | Yuji Nakura, Ryosuke Hata | 2001-06-12 |
| 6218469 | Unsaturated elastomer compositions and their vulcanized rubbers | Kenichi Morizono, Keiji Okada | 2001-04-17 |
| 6147876 | Multi-chip module having printed wiring board comprising circuit pattern for IC chip | Mitsutoshi Sawano, Kazutoshi Hohki | 2000-11-14 |
| 6143827 | Olefin thermoplastic elastomer composition | Kenichi Morizono, Keiji Okada | 2000-11-07 |
| 6086683 | Low-melting alloy and cream solder using a powder of the alloy | Tadahiro Toki, Koichi Aono, Hirofumi SAKAMOTO, Yasuhide Ogasawara, Masuo Hotta +2 more | 2000-07-11 |
| 6063886 | Cycloolefin copolymers and uses thereof | Kazuyuki Takimoto | 2000-05-16 |
| 6029560 | Fluid pressure operated torque amplifier and a vehicular power steering system incorporating same | — | 2000-02-29 |
| 5948860 | Propylene polymer compositions | Shoji Hiraoka, Hajime Inagaki, Mikio Hashimoto | 1999-09-07 |