Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6310147 | Epoxy-resin composition and use thereof | Tatsuhiro Urakami, Kenichi Sugimoto, Takuo Tajima, Keisuke Takuma, Tadahito Nobori +1 more | 2001-10-30 |
| 6124548 | Wire assembly apparatus and method for assembling wires | Jun Nakata | 2000-09-26 |
| 5945503 | Polymaleimide resin composition and laminate plate for semiconductor substrate using it | Keisuke Takuma, Takuo Tajima, Yoshiyuki Shindo, Tatsuhiro Urakami, Atsuo Otsuji +1 more | 1999-08-31 |
| 5945635 | Wire assembly apparatus and method for assembling wires | Jun Nakata | 1999-08-31 |