Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11396164 | Electronic component and method of manufacturing electronic component | Masayuki Ishikawa, Kaoru Nishizawa, Akihiro Yoshida, Hiroki Sato | 2022-07-26 |
| 11264534 | Method for manufacturing package lid member and method for manufacturing package | Hironori Uno | 2022-03-01 |
| 11158766 | Lid material for packages including reflowed gold-tin layers, and method for manufacturing package | Hironori Uno | 2021-10-26 |