Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5657123 | Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank | Osamu Endo | 1997-08-12 |
| 5531635 | Truing apparatus for wafer polishing pad | Osamu Endo | 1996-07-02 |
| 5226404 | Cutting apparatus | Hiro Ohzeki | 1993-07-13 |
| 5209216 | Chain cutter | — | 1993-05-11 |