Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830985 | Method and apparatus for producing bonded dielectric separation wafer | Hitoshi Okuda | 2004-12-14 |
| 6815774 | Dielectrically separated wafer and method of the same | Kazuya Sato, Hiroshi Shimamura | 2004-11-09 |
| 6562692 | Dielectric isolated wafer and its production method | — | 2003-05-13 |
| 6472289 | Dielectrically separated wafer and method of manufacturing the same | Kazuya Sato, Hiroshi Shimamura | 2002-10-29 |