Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11939447 | Thermosetting composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | Kentaro Takano | 2024-03-26 |
| 11760871 | Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | Kentaro Takano | 2023-09-19 |
| 11098195 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board | Kentaro Takano | 2021-08-24 |
| 10689496 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board | Daisuke Ueyama, Kentaro Takano | 2020-06-23 |