MK

Masashi Kurokawa

MC Mitsubishi Gas Chemical Company: 11 patents #164 of 1,727Top 10%
RE Renesas Electronics: 2 patents #1,855 of 4,529Top 45%
IC Ishida Co.: 1 patents #174 of 307Top 60%
MI Mitutoyo: 1 patents #455 of 721Top 65%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
📍 Ritto, JP: #17 of 205 inventorsTop 9%
Overall (All Time): #285,295 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12319460 Box packing apparatus Teruyuki Tada 2025-06-03
9334365 Polyamide resin moldings Jun Mitadera, Takahiro Takano 2016-05-10
9163117 Polyamide resin Jun Mitadera, Shigeyuki Hirose, Nobuhiko Matsumoto 2015-10-20
8895122 Polyamide resin composition and molded product Jun Mitadera 2014-11-25
8895121 Polyamide resin composition and molded article Jun Mitadera 2014-11-25
8603600 Polyamide resin compositions Jun Mitadera, Takahiro Takano 2013-12-10
8487648 Semiconductor integrated circuit Kenichi Kawakami 2013-07-16
8124204 Multi-layered bottle Jun Mitadera, Tomomichi Kanda, Kazunobu Maruo 2012-02-28
8071910 Laser processing apparatus Kenji Okabe, Shoichi Tanaka 2011-12-06
7982490 Semiconductor integrated circuit Kenichi Kawakami 2011-07-19
7927678 Multilayer bottle Jun Mitadera, Tomomichi Kanda, Kazunobu Maruo 2011-04-19
7723435 Fuel barrier single-layered structure and multi-layered shaped article Kazunobu Maruo, Kazunobu Sato 2010-05-25
7323513 Fuel barrier thermoplastic resin composition and shaped article Kazunobu Maruo, Kazunobu Sato 2008-01-29
7053172 Fuel-barrier polyamide resin and multilayer shaped article Kazunobu Sato, Kazunobu Maruo, Jun Mitadera 2006-05-30
5068281 Process for the production of molded article of fiber-reinforced thermosetting resin, and materials therefor Hiroyuki Okumura, Akira Namikawa, Hiroka Tanisake 1991-11-26
4822846 Molding polyamide resin composition Isao Nomura, Kenichi Narita 1989-04-18