Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017424 | Fitting method and repair method | Yuichi Yui, Akihiro TERASAKA, Kenji Wada, Yoshifusa Tobata, Koichi Hasegawa | 2024-06-25 |
| 10456961 | Bonding apparatus and bonding method | Akihiro TERASAKA, Jun Eto | 2019-10-29 |