Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7078330 | Metal electrode and bonding method using the metal electrode | Akira Maeda, Takeyuki Maegawa, Shigeru Matsuno, Takanori Sone, Shoji Miyashita +4 more | 2006-07-18 |
| 6722614 | Satellite deployment structure | Tsuyoshi Ozaki | 2004-04-20 |
| 6241145 | Lead-free solder joining method and electronic module manufactured by using the method | Akira Maeda, Toshio Umemura | 2001-06-05 |